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Semiconductor Photoresist Ultrasonic Lithography Coating System

Hangzhou Qianrong Automation Equipment Co.,Ltd
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Semiconductor Photoresist Ultrasonic Lithography Coating System

Brand Name : FUNSONIC

Model Number : FS620

Certification : CE

Place of Origin : CHINA

MOQ : 1 UNIT

Price : Negotation

Payment Terms : T/T, Western Union

Supply Ability : 1000 unit per month

Packaging Details : Packed by Wooden Case

Production Name : Ultrasonic Precision Spraying Machine

Frequency : 60khz

Max Power : 1-15W

Continuous Spraying Volume Max : 20-1200ml/h/pcs,Scalable

Effective Spraying Width : 2-260mm/pcs,Scalable

Spray Uniformity : ≥95%

Solution Viscosity : ≤30cps

Input Voltage : 220V±10%/50-60Hz

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Semiconductor Photoresist Ultrasonic Lithography Coating System



Description:


Ultrasonic spraying is a simple, economical, and reproducible process for photoresist coating in photolithography wafer processing. FUNSONIC's semiconductor photoresist ultrasonic lithography coating system uses advanced layering technology to finely control flow rate, coating speed, and deposition amount. Low speed spray molding defines atomized spray as an accurate and controllable pattern to avoid overspray and produce very thin and uniform layers.
FUNSONIC's semiconductor photoresist ultrasonic lithography coating system has advantages in depositing more uniform coatings, especially along the top of the sidewalls of high aspect ratio grooves and V-shaped groove structures. Centrifugal rotation cannot deposit uniform coatings along the sidewalls, without accumulating too much photoresist at the bottom of the cavity.



Parameters:

Product Type

Ultrasonic Precision Spray Coating Machine Laboratory desktop Type

FS310

Intelligent Ultrasonic Precision Coating Machine desktop Type

FS620

Spray Nozzle Operating Frequency 20-200KHz 20-200KHz (Normally use 60100110120K)
Nozzle Power 1-15W 1-15W
Continuous Spraying Volume Max 0.01-50ml/min 0.01-50ml/min
Effective Spraying Width 2-100mm 2-100mm
Spray Uniformity ≥95% ≥95%
Solution Conversion Rate ≥95% ≥95%
Dry Film Thickness 20nm-100μm 20nm-100μm
Solution Viscosity ≤30cps ≤30cps
Temperature Range 1-60℃ 1-60℃
Atomized Particles (Median Value) 10-45μm (distilled water), determined by the frequency of the nozzle 10-45μm (distilled water), determined by the frequency of the nozzle
Diversion Pressure Max ≤0.10MPA ≤0.15MPA
Input Voltage 220V±10%/50-60Hz 220V±10%/50-60Hz
Exercise Mode X+Y two axis fully automatic, Z-axis manual adjustment XYZ three-axis, independently programmable
Control Mode Micro computer card, 7-inch touch screen+buttons FUNSONIC spraying control system, PLC control, 13.3-inch full-color touch screen
Control Content Ultrasonic spraying, liquid supply, heating, ultrasonic dispersion and other systems Ultrasonic spraying, liquid supply, heating, ultrasonic dispersion and other systems
Liquid Supply Method Precision injection pump Precision injection pump
Ultrasonic Dispersion System (Optional) 50ml, 40K, biological grade sampler 20ml or 50ml, 40K, biological grade sampler
Rated Power of Ultrasonic Dispersion System 200W,10A 100W


Advantages:

1. Uniform film coverage of various surface contours.
2. Able to coat high aspect ratio grooves with excellent uniformity.
3. Non clogging atomizing spray.
4. Capable of depositing highly uniform single micron thin layers.
5. Repeatable mature spraying process.


Semiconductor Photoresist Ultrasonic Lithography Coating System

Semiconductor Photoresist Ultrasonic Lithography Coating System

Semiconductor Photoresist Ultrasonic Lithography Coating System




Semiconductor Photoresist Ultrasonic Lithography Coating System

Semiconductor Photoresist Ultrasonic Lithography Coating System

Semiconductor Photoresist Ultrasonic Lithography Coating System


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